ECD

Now, ECD, the Lead - Free Profiling Leaders, announces the first thermal profiler that is RoHS Compliant. This new lead free transition is dramatically changing soldering recipes as well. The new requirements will result in higher process temperatures and narrower process windows. As a result, thermal profiling is becoming much more important in order to maintain high yields, keep energy costs at a minimum and produce better quality products.
|
SuperM.O.L.E.® Gold 2 Thermal ProfilerSuperM.O.L.E.® Gold 2 continues the legacy of the original SuperM.O.L.E® Gold Thermal Profiler. With all the power of a MEGAM.O.L.E.® 20, it retains the same form factor, thermocouple connector type, channel count (6), and RIDER-product compatibility. |
||||
FEATURES | |||||
| |||||
BENEFITS | |||||
|
|
M.O.L.E.® MAP SoftwareM.O.L.E.® MAP is ECD's current software for setup, download, analysis, prediction and data storage that ships with the all new SuperM.O.L.E.® Gold 2 thermal profiler, the MEGAM.O.L.E.® 20, the V-M.O.L.E.®, the PTP® VP-8 and the SuperM.O.L.E.® Gold, ECD's work-horse thermal profiler. “MAP” stands for Machine (reflow oven), Assembly (test article) and Process (solder paste). Our aim is to help Engineers optimize their Machine-Assembly-Process, and we know that time is money. M.O.L.E.® MAP software is designed to be Easy-to-Use, Flexible and Robust…no small undertaking. | |||
FEATURES | ||||
|
|
OvenRIDER NL 2Look to ECD’s OvenRIDER® NL 2* if you need to VERIFY an oven’s performance:
Regardless of the recipe and what your oven's controls indicate, what your PCB actually experiences at board-level as it goes through the oven can be SIGNIFICANTLY different. Achieve convection reflow oven Verification by separating zonal temperatures from convective heat flow efficiency while verifying conveyor speed for a true picture of oven Lead-Free performance consistency. | |||
FEATURES | ||||
|
Visit their web site at - http://www.ecd.com [Back...]